VPX Extender Cards Product Datasheet. Performs an amazing range of applications, and tests such as OpenVPX Rule Compliance testing and certification, system design validation and characterization. Conduction cooled base coupled, via short and effi cient thermal path, provides for optimum cooling. 0 specification for use in. 66A steps, 3V3_VS2 0A. Rugged Conduction Cooled Assemblies and Modules. 3 V. pitch, high-bandwidth backplane, and 400 W power supply. VPX-4U-Chassis-Datasheet. Pixus has a wide variety of modular 19" rackmount, desktop, and ATR enclosure platforms for CompactPCI Serial systems, allowing virtually limitless configurations. While Hartmann Electronic thrives on the development and production of high-speed backplane technology, what good would our backplanes be without a high-quality enclosure?Accommodates up to ten 6Ux160mm conduction cooled VPX cards. With moveable rear profiles (up to 2. The WILDSTAR 3XV7 integrates Xilinx's new Versal™ Premium VP1502 or VP1702 FPGA. Important Notice: Other accessories, manuals, cables, calibration data. Files (3) VPX VITA CARD 3U /. 1, AMC. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. manufactures a variety of rugged modular conduction cooled chassis as well as 19” and 19” 1/2 form factor enclosures and a full range of 3U and 6U COTS modules for VPX , VITA 73 and CPCI applications. 6U / VITA 62 / 580W. μTCA Conduction Cooled Chassis ½ ATR with 6 AMCs. Power Supplies are available in 3U and 6U, in air- and conduction- cooled form factors >for cPCI, VPX, VME64x & custom applications. 2 coaxial/RF for four of the slots (defaultbackplane routing) All I/O are thru the front of the chassis; 250W integrated. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. The…. Intel® Xeon® D-1500 Family Processor-Based Conduction- or Air-Cooled 6U VME SBC. The XPand1203 is a low-cost, flexible, development platform. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. About. WILDSTAR 3XV7 3U OpenVPX FPGA Processor – WB3XV7. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Airstack ® air-cooled modules are available in a wide range of capacities and with tandem scroll compressor sets to create chillers with a 10 to 600 ton. Supports complete range of convection- and conduction-cooled formats (IEEE 1101. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. 0 specification. 05 G2/Hz-IS to $5_C 2 (,]o_) Table I -DSS Requirements Summary A block diagram of the DSS is shown in Figure 4. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. Meets ARINC 404A and ANSI/VITA 48. Description. VPX-REDI defines design parameters for enhanced cooling features and maintenance strategies to effectively support the increased power draw of high-density electronic systems. 16. It is conduction-cooled through the card edge/wedgelock. X-ES / Extreme Engineering Solutions XPand4200 Standard Sub-1/2 ATR Forced Air-Cooled Chassis for Conduction-Cooled Modules. PXI Express Chassis. About. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. Home. e. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. Architecture: VPX/OpenVPX : Cooling: Liquid-Cooled : Depth: 12. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. 3U CompactPCI. The Intel® Atom™ E3800 processors provide excellent computational performance and I/O functionality for their power profile and size. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow customization of. The front load card orientation optimizes space efficiency, serviceability and cooling. Subrack based, sheet metal, desktop or tower configurations. The VT874 provides three AMC mid-size slots that can accept any AMC. Over the evolution of its near 40 years of existence, VME-bus has become a worldwide standard and is still used in a wide variety of. This 5 slot Hartmann VPX 4U system chassis provides an intelligent, practical packaging solution for high-performance processors. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. RuSH enhanced 3u conduction cooled power supply Wedge-lock style card guides to support conduction cooled boards available as an option. Air-Cooled variants are designed to be used in standard industrial VME chassis. View product. The XPand6200 Series is a true Commercial-Off-The-Shelf (COTS) rugged system, supporting many 3U VPX, XMC, and PMC modules without modifications to the chassis or backplane to accommodate I/O. Hartmann is able to deliver a more rugged 19” solution when compared to the standard, as necessary or desired. The XPand1011 system is a low-cost development platform for conduction-cooled 6U VPX cards. CompactPCI Serial Chassis. The liquid-cooled chassis sidewalls will support electronic modules each dissipating in excess of 150 watts. The ANSI VITA 62 standard defines the mechanical and electrical specifications for commercial-off the shelf plug-in power supply modules in 3U and 6U format. VME and VME64x VPX Systems Hardware Platform Management Components - AdvancedTCA. Heat dissipation by 1 fans (fan tray), cooling bottom. These PSUs are available in 3U or 6U form factor. 6U/ 5HP VPX load card, conduction cooled. 6"W x 9. Rackmount 19” chassis for VPX, SOSA-aligned, VME, cPCI and ATCA architectures. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. or 1. Enclosures that accommodate up to twelve 3U and 6U VME, CompactPCI and VPX conduction-cooled boards. Dawn VME Products {3 to 5 Slot VME Chassis - Full Size VME Chassis - Standard - TableTop} Elma Electronics Inc. As system density has increased, the need for more aggressive and innovative thermal management techniques are needed. Conduction Cooled VMEbus Modules. RCOM05 6U CPCI, 6U VME 5 295 x 160 x 248 CPCI, VME Conduction Cooled Dual in; 16-40V DC 65W<br /> RCOM05-ATR-6V Other 5 194 x 124 x 320 CPCI, VME Conduction Cooled 16-40V DC 300W<br />. Additional backplanes are available, including VME,. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. ACT offers a variety of innovative heat pipe HVAC solutions that will take a big bite out of your energy bills and provide a rapid return on your initial. Dawn VME Products is committed to leadership in SOSA modules and infrastructure. VTX989 is a five slot 3U VPX conduction cool chassis; Base plate cooling (cold wall is in the bottom of the chassis) Integrated Power Module within the Chassis; Support for VITA67. 5A, 3. Subrack based, sheet metal, desktop or tower configurations. (W) x 5. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. The 50HP wide, rack-mountable enclosure for vertical mounting of boards is outfitted with a 300W ATX power supply and a 1U removable, bottom mount fan tray. This helps multi-sourcing, and means that a range of chassis architectures is available to suit different deployed scales and architectures. Revolutionary design allows for up to 175 Watts per slot of conduction cooling; Precision machined from 6061 T6 Aluminum; Corrosion resistant gold alodine finish; Field installable using 4-Torx driven screws; Fits all Dawn DC-n series development chassis; Installs in place of plastic guides; Converts air cooled chassis to conduction cooled Learn more about Hartmann Electronic's card guide with a conduction cooled cold plate 50HP for Open Frame Chassis, 5HP slot pitch. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. 4 PTC resistors (TMP300 IC); one each at the front at bottom and top as well as rear top and bottom, analog output 10mV/°C (typical 750mV ±30mV at 25°C), Optional DVM plug-on board, Voltage and temperature sense lines are connected to 2 x 8 pin header (X1 connector) on front panel, Voltage levels for. 2 specification. 0 in. or 1. This platform conforms to VITA 1. Air-Cooled Scroll Modular. 64PS1 - North Atlantic Industries. 10 Mechanical standards; 6U (VXS/ OpenVPX/VPX/VME64x / cPCI) Backplane Options; 1U to 11U High Card Area; 2 to 21 Slots; Custom specific Switch Controls and indications; Forced Air Convection Cooled; AC / DC Input power supply; EMI/RFI. Communications Intelligence (Ground Mobile) SIP designs communication and signals intelligence computers for rugged ground mobile applications. Ordering Information: Dawn P/N 11-1017332. 0 CompactPCI standard, which uses the parallel PCI bus for communication among a. The 9U, 12R2 is designed to meet the harsh environment of shipboard, airborne, and ground mobile applications per MIL-STD ’s. Development chassis and accessories for VPX and SOSA aligned module payloads to support every stage of. The Hybricon portable tower conduction-cooled enclosures are high performance development chassis with cooling for up to 150W per slot. Cooling: Conduction cooled. Block Diagram. including surveillance, data collection, storage and weapons control. The chassis is cold plate base coupled conduction cooled. 64PS1 - North Atlantic Industries. 28 - 0. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. Up to 128 Gbytes DDR4 memory for server grade applications. Conduction cooling is defined as the transfer of heat through solids. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. The study focuses on the cooling limitations of a 6U VME by conduction. Application. 10-core processor for high performance. The VPX340 (400W) and VPX336 (360W) can be used to power VPX / Open VPX chassis and will fit into the standard envelope defined by VITA 48. This helps multi-sourcing, and means that a range of chassis architectures is available to suit different deployed scales and architectures. The recessed card cage fits 5-slots of VPX at 1-inch pitch with side-to-side push-pull cooling. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. Conduction cooled card guide for Dawn DC-(n) Series air cooled development chassis. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. These rugged enclo-sures are available to support either one-inch or 0. In addition to theseThe Conduction Cooling Experts: Advanced Thermal Management Equals Reliability With a heritage of more than 30 years, Curtiss-Wright has long been recognized as the COTS industry’s leading expert in the design of conduction cooled standards based modules. The XPand1303 is a low-cost, flexible, development platform. 3 V. Our cardcages conform to DIN 41494 and IE 1101. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. PXI Express Chassis. CompactPCI Serial Chassis. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. This GE Fanuc / Radstone PPC2EP-603-5CG VME Conduction Cooled Single Board Computer is new from surplus stock. Dawn’s DEV-4117 Multi-Platform Table-Top Development Chassis for 6U boards coupled with Dawn’s Hybrid VME64x/VPX backplane provides a natural migratory development environment and path for upgrading systems to the latest VPX technology. 8 in. Embedded RuSHTM technology. • (3) Ethernet Ports. PXI / PXIe Chassis Our PXI and PXIe solutions are designed and. PCI was the first universal, processor-independent computer bus that was adopted by all major microprocessor manufacturers. Motorola – Single board chassis design with natural convection requirement. These rugged power supplies are available in 200W-1300W power configurations with. pdf;Physical Characteristics. The VME/PMC 64x Conduction-Cooled Carrier is a 6U VME card that supports up to two (2) PMC modules. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. Conduction-cooled PMCs, PPC4A offers expansion with a family of standard PMC Carrier Cards. 1 compliant cPCI, 2 through 8 slots, 32 bit or 64 bit configurations, +5VIO or +3. Conduction Cooled. Rugged Conduction Cooled Assemblies and Modules. Offered as part of firm’s Test/Development chassis for OpenVPX, CompactPCI and VME/VME64x systems, products fit in IEEE 1101. VME 11; PCI Express 10; cPCI 3U 9; 3U VPX 8; Software 6; Thunderbolt 3 6; VXI 6; 3U 5; cPCI 6U 5; PCI 4; ISA 3; Mini PCI Express 3;. With moveable rear profiles (up to 2. PICMG 2. Heat frames can be designed for compliance with IEEE 1101. SOSA™ Aligned Technology Capabilities Rugged Chassis for Mobile Military/Aerospace Applications Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses; Environmentally Sealed; Compact and Lightweight with 5 Standard VME64x Slots; Internally Conduction-Cooled; Externally Cold Plate Cooled; Fully Sealed Faraday Cage and Complete EMI/RFI Power Line Filtering Cooling: Air flows around a finned, conduction cooled internal, sealed chassis and exits rear of chassis pulled by a single exhaust Tubeaxial high air flow 28V exhaust fan (can be powered with internal AC supplies) – less expensive option desired Liquid cooling, typically at the base, relying on conduction from chassis; Air cooling, using fins directly attached to the chassis sidewalls; HIK™ CARD FRAMES SOLVE THERMAL MANAGEMENT CHALLENGES. Load sharing circuitry for up to 4 modules. 6U VPX & VME Systems. VPX is specified for 3U and 6U boards and for air cooled, conduction cooled and even liquid cooled chassis. 3VIO, Short tail connectors on J1, long tail connectors on J2. Multiple backplane configurations available. A user's guide to the VME, VME64 and VME64x bus specifications - features over 70 product photos and over 160 circuit diagrams, tables and graphs. Aitech’s C162 is a high-performance 6U VME SBC for embedded and harsh environment applications. . It supports up to two 0. ATR Chassis For Conduction-Cooled VME Boards Product Information Radstone ATR chassis provide the highest level of environmental protection combined with exceptional packing density and thermal performance. VME VME P2 Figure 3: PPCM1 I/O Diagram Ruggedization Levels PPCM1 is available in Radstone’s 5 environmental ruggedization levels (see Table 1). This forced-air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810F/G while integrating the latest power-saving and performance-enhancing technology. 8 GHz : 2x PMC/XMC : Rugged Air Cooled and Conduction Cooled : Available in multiple ruggedization levels : SBC314C Flight-Certifiable Single Board ComputerVPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. 1, IEEE 1101. Rather than a single specification, VPX is a set of base, environmental, mechanical and dot specifications, defining several – mainly rugged – capabilities and features for new VITA-compliant systems. Our VME and mezzanine switches and routers provide systems integrators with a fast and powerful way to interconnect chassis, cards, and processors through switched Gigabit Ethernet links. SOSA Products. Thermal design, simulation and analysis services. Important Notice: Other accessories, manuals, cables, calibration data, software, etc. Conduction-cooled PMCs, PPC4A offers expansion with a family of standard PMC Carrier Cards. The chassis comes with different sizes and are equipped with various backplane options vis-à-vis 3U/6U. 0 specification for use in Mil/Aero VPX systems. Operating temperature range is -40°C to +85°C. Rhino - 3U/6U Liquid Cooled. Configuration: • System Power: 400W. 10U VME64X Ground Mbile Rugged Enclosure. 88 in. This ¾ Long ATR ships with a 6U, 5-slot OpenVPX™ backplane and can accommodate other architectures such as 6U CompactPCI®, VME and VXS. Utilizing our extensive experience in embedded. PXI /. A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. Abstract: A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. We offer a wide range of ATR chassis that are convection, conduction cooled and liquid cooled. Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. 62. Front mounted power switch. 3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules. The power supply is plugged into rear behind the fan tray. Ability to work with existing board, frame, or chassis designs. Onboard embedded RuSH™ technology actively monitors voltage, current, temperature and provides protective control. Agnostic OpenVPX embedded computing cooling technology from Mercury Systems can be packaged as circuit board-only, Air Flow-By and Liquid Flow-By, conduction cooled and Liquid Flow-Through, Air. External cooling configurations include natural convection cooling, forced air (fan) cooling and. 1 PICMG 2. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. 8” slot. 15A in 1A steps, +12V_AUX 0. pitch conduction-cooled CompactPCI modules. 54 mm) pin spacing, CompactPCI cards use metric connectors with a 2-millimeter pin spacing, designed to the IEC 1076. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. 1-1997 while providing a low profile, practical packaging solution for high-performance. 62”H; 1ATR ARINC 404A Tall/Long format Weight: TBD Electrical Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules. 3U VPX, 1/2 ATR, Conduction Cooled. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. 2. 3U CompactPCI 2. Conduction cold plates with enhanced material conductivity such as Thermacore’s k-core APG and heat pipe cold plates in the VPX format can be used to design electronic systems with power levels above that possible with pure aluminum cold plates, but can still rely on conduction cooling rather than utilizing active systems such as forced. 64PS1 - North Atlantic Industries. Works With: Conduction Cooled Enclosures Clamp Force: 300 – 399 lbf / 136 – 181 kg Gap Width: PCB + (0. PSC-6238 3U VITA 62 / 800W 28VDC Input Conduction Cooled PSC-6265 6U VITA 62 / 580W Universal AC Input Conduction Cooled PSC-8724 3U / VITA 62 Low Power High Efficiency with Integrated Hold-upAn open-frame solution for the open-minded engineer. Includes one solid state Disc Drive Carrier mounted on the side behind front I/O panel. 2-7. Compliant with VITA 65 Specification. With moveable rear profiles (up to 2. CompactPCI Serial Chassis. 2SS-311. Paper ID: SR22628105125 DOI: 10. The entire liquid conduction cooled chassis is built at our Longmont facility. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. Defense applications require a range packaging approaches and LCR has the proven products to meet mission objectives with ATRs for SWaP constrained installations or 19-inch chassis for larger scale computing needs. Backplanes options - cPCI, PCI, VME64x, VME/VME64, VPX and custom. 0 specification for use in Mil/Aero VPX systems. 8-Slot, 3U x 80mm, 1101. • Backplane: With J0 Connector. 3U/6U (VPX / cPCI/ VME) Backplane Options. They can be used to power a VPX chassis and will fit into the. Boards are clamped in place using expanding screw driven wedgelock assemblies and cooling is entirely by conduction through internal. They are designed for circuit boards. VME and VME64x VPX Systems Hardware Platform Management Components - AdvancedTCA. CPCI Chassis. MIL-STD-704F compliant except 50mSec holdup provided by separate module. Environment: Extended Temperature, Extended shock & vibration : Height: 10. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. 5"L x 5. Mounting Style: Desktop. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. Defense applications require a range packaging approaches. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. Conduction cooled base coupled, via short and efficient path, provides for optimum cooling. CPCI Chassis. It supports up to two 0. Configure your VME SYSTEM. 5-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. Part Number: 11-1011777-2119. Thermal design, simulation and analysis services. Height: 7. 6U CompactPCI. CP931FP is a 6U CompactPCI managed Layer 2, 3, and 4 switch with 24 10/100BaseTX ports and 2…. By leveraging low cost silicon and software developed for PCI, CompactPCI has become the world’s most popular modular open computer. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. card assemblies in a format suitable for military and rugged applications and to ensure their compatibility with both conduction cooled chassis and commercial, air-cooled, single height (3U) and. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. Ability to work with existing board, frame, or chassis designs. 87"W x 3. We offer a wide range of ATR chassis that are convection, conduction cooled and liquid cooled. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. PXI /. 2 specification. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor. This specification is applicable to, but not limited to, the VMEbus standard, an internal interconnect (backplane) bus intended for connecting processing elements to their immediate fundamental resources. 0") Operating temperature range of -40°C to +85°C. Up to 20 CFM of airflow is provided per slot. 1 switch and 10G backplane Ethernet switch in a single 3U module, enabling you to connect between a wide range of module types – including those with earlier Gen 1 or Gen 2 PCIe interfaces. 10A in 0. Other connectivity options are available, such as runningVME64x 1U/84HP 2 Slots. Chassis Platforms Product Type Elma Air Transport Rack (ATR) enclosures offer a standardized, cost effective solution for VME, VME64x, CompactPCI, VXS, VPX and Small Form Factor (SFF) based applications. or 1. ACT manufactures copper/water heat pipes into two basic geometries: Tubular Heat Pipes and Planar Heat Pipes. PSC-6265. MS216479+RC. Supports air cooled and optionally conduction cooled boards. CompactPCI Serial Chassis. 1 6U part # description VME-HF-3U 3U VME Heat Frame Blank Assembly Kit VME-HF-6U 6U VME Heat Frame Blank Assembly Kit CPCI-HF-3U 3U. Aitech’s C164 is a high-performance 6U VME SBC for embedded and harsh environment applications. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. 8” slot. ATR, rugged, air- and conduction-cooled, Integrated Systems} kontron {VME Rugged-Standard-3 to 18 slot} MacroLink Inc. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. This switching power supply accepts a +5 VDC input and converts it to a single +3. Full environmental sealing insures reliable operation in any environment. Conduction cooling methods move heat from the source to a cooler area over a short distance; the heat can then be removed by liquid- or forced-air cooling. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. For example, developments can begin on the bench with 6-slot air-cooled systems and then migrate to 12-slot 19" rack equipment or conduction-cooled ATR solutions while using the same plug-in card. 20 dimensions for conduction cooling, and meets the VITA 47 ECC4 ruggedization specifications for shock, vibration, and operating temperature range of -40° C to +85° C. CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction CooledWatch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. Available in 3U or 6U form factors, the conduction-cooled chassis support a wide range of architectures, including VPX, VME, VME64x, VXS, and CompactPCI. Height: 10. 1ϕ / 3ϕ AC or 28v DC Input power supply (up to 1500w) Input Transients as per MIL-STD-704E / MIL-STD-1275D. 0 in. ATR Chassis For Conduction-Cooled VME Boards Product Information Radstone ATR chassis provide the highest level of environmental protection combined with exceptional packing density and thermal performance. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Airborne, shipborne and ground deployment. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. It is based on the established PICMG 2. It is conduction-cooled through the card edge/wedgelock. Built with aero-grade aluminum, the chassis are suitable for rugged onboard/mobile applications and can operate under extreme temperatures, dust and humidity. 8 does not use module-to-chassis conduction cooling, it also promises to help drive innovative use of new lightweight polymer or composite material-based chassis. It is 100GbE-enabled, SOSA-aligned, and highly rugged and thermally. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. CAD templates and 3D printed prototypes available. 3"H Chassis Cooling: Conduction-Cooled Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/OTR MAx/6sd-RCx – Rugged 3U VPX Plug In Card. Description: The Model 8006 is a conduction cooled Half-Short ATR chassis with a 4-slot VME 64x or cPCI backplane standard. 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules. In addition to rugged enclosures, we also offer a range of development platforms for the latest technologies such as OpenVPX. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. 100G Ethernet Data plane. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5. Utilizing our extensive experience in embedded. 8 in. Operating temperature range: -40°C to +85°C. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. Advanced airflow design distributes air across external fins in sidewalls. CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; OpenVPX 6U 8-slot ATR Chassis; RME-6460 6U VPX 2-16 slots Rack Mount EnclosureThis 5 slot Hartmann VPX 4U system chassis provides an intelligent, practical packaging solution for high-performance processors. 52 in. 3U Air cooled models available in 1. This short 1/2 ATR ships with a 6-slot OpenVPX™ backplane and can accommodate other architectures such as 3U CompactPCI® and MicroTCA™. (ACT) is a premier thermal management solutions company, focusing on custom applications of two-phase heat transfer technology. Trident offers a wide range of ATR chassis that are convection, conduction cooled, forced air conduction cooled and liquid cooled. 52”L x 7. 1-1997 while providing a low profile, practical packaging solution for high-performance. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system. It is conduction-cooled through the card edge/wedgelock. Designed to meet the requirements of VITA 62 for use in harsh environments. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Optionally it can be outfitted with a rear transition card cages. <br /> If you’ve ever dreamed about controlling<br /> your VME system directly from your desk-<br /> top system, your dream. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. As VXS is based on a 0. Packaged as a single-slot VME module, the conduction-cooled ruggedized C5100-R conforms to the IEEE 1101. Five slots 3U VPX conduction cooled Chassis. Compared to conventional wedge locks, the ICE-Lok creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. 8 in. Learn more about Hartmann Electronic's card guide with a conduction cooled cold plate 50HP for Open Frame Chassis, 5HP slot pitch. An assortment of lab chassis with DSUB rear I/O, extenders and bus extenders round off the classic product line. The XPand4200 Series redefines the limits of power, performance, and functionality in a sub-½ ATR chassis. Revolutionary design allows for up to 175 watts per slot of conduction cooling. . 0 specification. 4-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Universal AC Input. Higher conduction means lower component temperatures . 08 of Vita65. VXS offers backwards compatibility for existing VME/VME64x line cards for payload slots. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane interchangeability for fluid transition between VITA and PICMG bus architectures, the Hartmann Open Frame Chassis solution is the tool. • Backplane Slots: 9 VME64x J1/J2 Slots. Power Supplies are available in 3U and 6U, in air- and conduction- cooled form factors >for cPCI, VPX, VME64x & custom applications. The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. LCR’s field proven chassis have provided over 30 years of reliable service in a wide array of. (COTS) and customized conduction. 0 specification for use in Mil/Aero VPX systems. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 5″L x 6″W x 7. Designed for 6U Conduction Cooled Boards; Machined Aluminum 6061-T6 Construction; Front Load Design; Circular Connectors, indicators, and controls on Side Panel; Supports 6U backplanesPCI Systems Inc. The ATR-5700 uses a microcomputer controlled 600W 6-Channel, VPX power supply that operates at 94% efficiency. (H) Four 0. Example: 44KS2 +5 VDC to +3. It consists of a tunable laser(s), i wavelength tagging Michelson intefferometer, an optical distnl_Jti_“The solution there is primarily conduction cooling, dissipating 100 to 150 watts per enclosure, with a ceiling of more than 40 watts per slot in a 6U form factor. Chassis is capable to provide withstand Shock and Vibration defined by MIL-STD-810 as followed: - Shock: 40G in both Positive and. 97"H Chassis Cooling: Conduction-Cooled, Natural Convection-Cooled. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. These rugged enclo-sures are available to support either one-inch or 0. Downloads. 30 in. scroll down . Test chassis can test up to 6 Conduction Cooled VME 6U cards. 11") Connectors: 2 mm press-fit, quality grade 2. Intelligent VPX Test Module, also System Monitor and Load Board. Driven and supported by the PICMG group for more than 10 years, CompactPCI (CPCi) platforms are designed for modularity, ruggedization, Hot Swap, system management and provide densed computing performance, which is supported by optimized air or conduction cooled concepts. Input Voltages: 19-35 VDC. Our modular, aluminum chassis variants give you many different and interchangeable options for VPX and cPCI, as well as our rugged small form factor VITA 73. Min. Different slot counts dependant on slot pitch (0. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. Boards are clamped in place using expanding screw driven wedgelock assemblies and cooling is entirely by conduction through. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. Over the evolution of its near 40 years of existence,. 08/03/20231 ATR Liquid Cooled : Extended Description: This modular design ATR holds conduction cooled modules with independent dual liquid cooled side walls and a field-proven High Integrity Frame construction. Stock # 74927-1 . The mechanical design of VITA 48. This platform conforms to VITA 1. The XPand1202 provides a low-cost, flexible, VITA 67 development platform. 64PS1 - North Atlantic Industries. 2. This portable chassis is well built, attractive and travels well between the bench top, the trade show, and your customers. Two test point outputs and microcontroller- based. With 6U-VME conduction cooling, power dissipation per slot is limited by the cold plate on which the chassis is mounted. PXI Express Chassis. 3U 2 Slot OpenVPX Development Chassis.